PhD position · Universidad Politecnica de Madrid
HRER2026/393 Engineer for Advanced packaging of GaN-based HEMTs
- Type
- PhD position
- Organisation
- Universidad Politecnica de Madrid
- Location
- MADRID, Spain
- Deadline
- 16 October 2026
- Posted
- 28 September 2026
About this listing
Design, fabrication and characterization of packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: • Study and development of various packaging architectures (wirebonding and embedded chip) for high frequency and high power operation • Characterization of thermal dissipation and RF signal integrity in standalone and packaged devices by optical spectroscopy (Raman,...
Last checked 13 October 2026. The official page opens for members.