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Advanced 3D Packaging Integration Lead

Job · IMEC

Advanced 3D Packaging Integration Lead

Type: Job
Organisation: IMEC
Location: Heverlee, Belgium
Deadline: 1 December 2026
Found: 13 October 2026

About this listing

Turn groundbreaking 3D integration technologies into a manufacturing-ready platform for next-generation semiconductor products. Advanced packaging is reshaping how complex semiconductor systems are designed and manufactured.

Last checked 14 October 2026.

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