PhD position · Université de Sherbrooke
PhD-Optimization of Micropillar Microfabrication Process for Fan-Out Wafer Level Packaging
- Type
- PhD position
- Organisation
- Université de Sherbrooke
- Location
- Sherbrooke, Canada
- Deadline
- 30 December 2026
- Found
- 13 October 2026
About this listing
Context: Advanced packaging technologies are essential for the evolution of microelectronics, enhancing performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense.
Last checked 15 October 2026. The official page opens for members.