PostDoc position on Wafer Bonding Physics for 3D Chip Integration

Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked and interconnected to create faster, more compact and more energy-efficient semiconductor devices. However, the detailed mechanisms that determine bonding quality are still not sufficiently understood. Salary: EUR 3,706 to 5,760 a month.